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制造商编号 2502781
商品别名 RM116-D4E32W2
制 造 商 OKdo
唯样编号 A3-2502781
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描述
Radxa ROCK3 Compute Module(Radxa CM3) 4GB/32GB WIFI/BT (BULK 500)
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参数 参数值 操作
商品目录 ROCK SBC
主芯片编码 RK3566
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商品简介

Product Details

The ROCK 3 Compute Module (CM3) is an incredible System on Module (SoM) based on a powerful Rockchip RK3566 System on Chip (SoC) that will boost your design application and enlarge its capabilities. The ROCK CM3 features 4GB LPDDR4 RAM, Quad-core Arm® Cortex®-A55 CPU, Arm Mali™-G52-2EE GPU, DRAM memory, 32GB eMMC flash storage and wireless connectivity, including WiFi 5 and Bluetooth® 5.0. This compute module benefits from multiple outstanding features incorporated in a compact board of just 55mm x 40mm, allowing you to incorporate it into various multimedia and industrial designs easily. Developed by OKdo Technology in collaboration with Radxa, the CM3 offers a cost-efficient solution out of the box for various embedded applications, expanding incredibly the capabilities of your project.


Key Features of the ROCK CM3 4GB:


Rockchip RK3566 SoC with 64-bit Quad Core low power cores up to 2.0GHz

CPU: Quad-core Arm® Cortex®-A55 (ARMv8) 64-bit @ 2.0GHz

GPU: Arm Mali™-G52-2EE, OpenGL® ES1.1/2.0/3.0/3.1/3.2, Vulkan® 1.1, OpenCL™ 2.1

NPU: 1 TOPs@INT8, support INT8, INT16, FP16, BFP16, support deep learning frameworks such as TensorFlow, Caffe, Tflite, Pytorch, Onnx, Android™ NN, etc.

RAM: 4GB LPDDR4

Memory: 32bit DDR4/3/3L/LPDDR4/4X/3 and support eMMC 5.1 and SFC

Display: Single display engine, HDMI2.0, eDP 1.3, Dual MIPI-DSI, combo with single LVDS, 24bit RGB/BT1120 and EBC interface

Multimedia: 4K H.265/H.264/VP9 video decoder and 1080p@60fps H.264/H.265 video encoder

Video input: 8M Pixel ISP and 1 x 4 lanes or 2 x 2 lanes MIPI CSI-2 and DVP interface

Audio interface: I2S0/I2S1 with 8 channels, IS2/I2S3 with 2 channels, SPDIF0, PDM0 with 8 channels, TDM) with 8 channels and Voice Activity Detection (VAD).

High-Speed Interface: One USB 3.0 host, two SATA 3.0, one PCIE2.1, two SerDes (serialiser/deserialiser) lanes, dual USB 2.0 host and one USB 2.0 OTG and a single RGMII interface

Security: Arm TrustZone® security extension, Secure Video Path, Secure JTAG to debug, Secure boot, OTP and Crypto (AES/TDES/SM4/SM3/SHA256/SHA512/RSA)

Power Requirements: the power input into the SoM is 5VDC at 5A.


Interfaces:


802.11 b/g/n/ac Wireless LAN (Wi-Fi 5) 

Bluetooth 5.0 with BLE 

8 x I2C 

4 x SPI 

8 x UART 

9 x PWM 

50 x GPIO 

2 x ADC 

1 x Gigabit Ethernet PHY 

Support PDM with microphone array 

I2S 

2 x SATA 

1 x PCIe 2.0, 1 lane host (5Gbps) 

1 x USB 2.0 

1 x USB 2.0 OTG 

1 x USB 3.0 (5Gbps) 

1 x SDIO 3.0 

1 x HDMI up to 4K x 2k@60Hz 

1 x eDP four lanes (2.7 Gbps per lane) 

2 x MIPI DSI @ 1.6Gbps per lane 

2 x MIPI CSI 

1 x 2 lane MIPI CSI camera port 

1 x 4 lane MIPI CSI camera port 

1 x LVDS combo four lanes, mux with MIPI DSIO 

eMMC size: 32GB

3 x 100 pins 0.4mm pitch B2B connector


Supported Software:


Debian/Ubuntu Linux support 

Android 11 support


Product Details

The ROCK 3 Compute Module (CM3) is an incredible System on Module (SoM) based on a powerful Rockchip RK3566 System on Chip (SoC) that will boost your design application and enlarge its capabilities. The ROCK CM3 features 4GB LPDDR4 RAM, Quad-core Arm® Cortex®-A55 CPU, Arm Mali™-G52-2EE GPU, DRAM memory, 32GB eMMC flash storage and wireless connectivity, including WiFi 5 and Bluetooth® 5.0. This compute module benefits from multiple outstanding features incorporated in a compact board of just 55mm x 40mm, allowing you to incorporate it into various multimedia and industrial designs easily. Developed by OKdo Technology in collaboration with Radxa, the CM3 offers a cost-efficient solution out of the box for various embedded applications, expanding incredibly the capabilities of your project.


Key Features of the ROCK CM3 4GB:


Rockchip RK3566 SoC with 64-bit Quad Core low power cores up to 2.0GHz

CPU: Quad-core Arm® Cortex®-A55 (ARMv8) 64-bit @ 2.0GHz

GPU: Arm Mali™-G52-2EE, OpenGL® ES1.1/2.0/3.0/3.1/3.2, Vulkan® 1.1, OpenCL™ 2.1

NPU: 1 TOPs@INT8, support INT8, INT16, FP16, BFP16, support deep learning frameworks such as TensorFlow, Caffe, Tflite, Pytorch, Onnx, Android™ NN, etc.

RAM: 4GB LPDDR4

Memory: 32bit DDR4/3/3L/LPDDR4/4X/3 and support eMMC 5.1 and SFC

Display: Single display engine, HDMI2.0, eDP 1.3, Dual MIPI-DSI, combo with single LVDS, 24bit RGB/BT1120 and EBC interface

Multimedia: 4K H.265/H.264/VP9 video decoder and 1080p@60fps H.264/H.265 video encoder

Video input: 8M Pixel ISP and 1 x 4 lanes or 2 x 2 lanes MIPI CSI-2 and DVP interface

Audio interface: I2S0/I2S1 with 8 channels, IS2/I2S3 with 2 channels, SPDIF0, PDM0 with 8 channels, TDM) with 8 channels and Voice Activity Detection (VAD).

High-Speed Interface: One USB 3.0 host, two SATA 3.0, one PCIE2.1, two SerDes (serialiser/deserialiser) lanes, dual USB 2.0 host and one USB 2.0 OTG and a single RGMII interface

Security: Arm TrustZone® security extension, Secure Video Path, Secure JTAG to debug, Secure boot, OTP and Crypto (AES/TDES/SM4/SM3/SHA256/SHA512/RSA)

Power Requirements: the power input into the SoM is 5VDC at 5A.


Interfaces:


802.11 b/g/n/ac Wireless LAN (Wi-Fi 5) 

Bluetooth 5.0 with BLE 

8 x I2C 

4 x SPI 

8 x UART 

9 x PWM 

50 x GPIO 

2 x ADC 

1 x Gigabit Ethernet PHY 

Support PDM with microphone array 

I2S 

2 x SATA 

1 x PCIe 2.0, 1 lane host (5Gbps) 

1 x USB 2.0 

1 x USB 2.0 OTG 

1 x USB 3.0 (5Gbps) 

1 x SDIO 3.0 

1 x HDMI up to 4K x 2k@60Hz 

1 x eDP four lanes (2.7 Gbps per lane) 

2 x MIPI DSI @ 1.6Gbps per lane 

2 x MIPI CSI 

1 x 2 lane MIPI CSI camera port 

1 x 4 lane MIPI CSI camera port 

1 x LVDS combo four lanes, mux with MIPI DSIO 

eMMC size: 32GB

3 x 100 pins 0.4mm pitch B2B connector


Supported Software:


Debian/Ubuntu Linux support 

Android 11 support


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